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          2. Global Layout

            Worldwide locations with six sites in Jiangyin, Chuzhou, Suqian, Singapore and Korea; and two major R&D centers in Singapore and mainland China

            Sites Introduction

            JCET D1

            JCET BU,JCAP-1

            Binjiang Road. Jiangyin, Jiangsu
            Floor Area:62,321 sqm/GFA:58,300 sqm
            Bumping, wafer level pkg and test
            Factory Certificate
            • ISO9001
            • IATF16949
            • ISO14001
            • OHSAS18001
            • QC080000
            • SONY GP
            • ESD20.20
            • IEC17025
            • ISO10012

            JCET D3

            IC BU, JCAP-2, JSCC,SJsemi

            Changshan Road, Jiangyin, Jiangsu
            Floor Area:374,882 sqm/GFA:372,500 sqm
            WLCSP, Bumping, Flip Chip, Leaded, MIS
            Factory Certificate
            • ISO9001
            • IATF16949
            • ISO14001
            • QC080000
            Factory Certificate
            • ISO 9001
            • ISO 14001
            • IATF 16949
            • OHSAS 18001
            • SONY GP
            • ESD 20.20

            JCET D9

            No.999 Century Avenue, Chuzhou, Anhui

            Floor Area:169,263 sqm/GFA:85,000 sqm
            Leaded, Discrete Package and Test
            Factory Certificate
            • ISO9001
            • IATF16949
            • ISO14001
            • OHSAS18001
            • QC080000
            • ESD20.20
            • SONY GP

            JCET D8

            No. 5 Purple Mountain Road, Suqian, Jiangsu

            Floor Area:84,122 sqm/GFA:53,700 sqm
            Power Package and Test
            Factory Certificate
            • ISO9001
            • IATF16949
            • ISO14001
            • OHSAS18001
            • QC080000
            • ESD20.20

            SCS

            5 Yishun Street, Singapore

            Floor Area:29,894 sqm/GFA:73,600 sqm
            Advanced Wafer Level Packaging, Laminate
            Factory Certificate
            • ISO 9001
            • ISO 14001
            • IATF 16949
            • OHSAS 18001
            • Sony GP
            • ESD20.20

            SCK/JSCK

            191 Jayumuyeok-ro Jung-gu, Incheon, South Korea

            Floor Area:110,117 sqm/GFA:110,200 sqm
            SiP,Flip Chip, BGA, CSP, Stacked die?
            Factory Certificate
            • ISO 9001
            • ISO 14001
            • IATF 16949
            • OHSAS 18001
            • Sony GP
            • ISO 14001/JSCK
            • ESD20.20

            R&D room

            STATS ChipPAC HQ R&D center

            Singapore
            Floor area 4750 sqm
            Tel:65-6853-8030
            Fax:65-6752-9589

            JCET HQ R&D center

            Jiangyin China
            Floor area 6872 sqm
            Tel:+86-510-86997519
            Contact Us |  Customer |  Legal

            Contact Us Customer Enquiry Legal

            Copyright @ Jiangsu Changjiang Electronics Technology Co., Ltd 蘇ICP備05082751號32028102000607

            Copyright @ Jiangsu Changjiang Electronics Technology Co., Ltd
            蘇ICP備05082751號 32028102000607

            Official Accounts of JCET

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