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            • Fan-in (FIWLP)
            • WLCSP

              (Bumping, Repassivation, RDL)
            • eWLCSP

              (encapsulated WLCSP)
            • Fan-out (FOWLP)
            • eWLB

              (embedded wafer level BGA)
            • 2.5D and 3D SiP eWLB

            • Integrated Passive Devices
            • IPD

            • Through Silicon Via
            • TSV for CIS

            • TSV for 3D IC

            Highlights

            Compact, high performance packages for rapidly shrinking product form factors

            Proven leadership in innovative FOWLP solutions with over 1.7 Billion units shipped

            Innovative 2D/2.5D/3D FOWLP packages with size, performance and cost advantages

            Enhanced performance and size reduction with silicon IPDs

            3D TSV capabilities covering mid-end-of-line through backend assembly and test

            • FOWLP SiP
            • Laminate FC SiP
            • Laminate FC + WB SiP
            • SiP Modules
            • Leadframe WB SiP
            • Laminate Stack Die WB SiP

            Highlights

            .Electronic system or sub-system integrates multiple active and passive components for higher performance, functionality, processing speeds and low cost

            .Leading SiP technology portfolio incorporates all the key technical building blocks

            Advanced design rules for 2.5D and 3D FOWLP or SiP configurations

            High density SMT with high accuracy component placement

            Advanced mold tech for complex topography SiP applications

            Highly automated process modules

            Tight process control to ensure consistency and high yield

            .One stop turnkey solution - wafer to fully tested SiP modules

            • fcCuBE
            • fcFBGA
            • fcBGA
            • Bare die fcPoP
            • (flip chip package-on-package)

            • Molded Laser fcPoP
            • (flip chip package-on-package)

            • flip chip on Leadframe
            • (FCOL)

            • fcMIS
            • (flip chip on Molded interconnect System)

            Highlights

            Patented fcCuBE : proven low cost, high performance advanced flip chip technology

            Fine pitch Cu pillar and Bond-on-Lead (BOL) interconnection for higher routing density at a lower cost Scalability to finer bump pitches, higher I/O and advanced fab nodes at a lower cost

            High speed fcBGA-H offering for network/communication market fcPoP and hybrid flip chip + wirebond configurations for increased functional integration in a smaller form factor, and Pre-stacking of memory on logic for PoP packages

            Leadership in low cost substrate technologies – Embedded Trace Substrate (ETS), Molded Interconnect System (MIS) and Single Layer laminate substrate

            Wire Bond Package

            • PBGA
            • FBGA
            • (Side by Side,Stached Die)

            • Package-on-Package
            • MEMS
            • Memory Card
            • LGA

            Highlights

            Advanced wirebond technology in a cost competitive manufacturing location

            Comprehensive range of single die, multi die, thermally enhanced and stacked die packages

            Thin outline LGA suitable for high performance and/or portable applications

            Low profile PoP provides flexibility in mixing and matching IC technologies in a thin package

            Innovative process capabilities to enable MEMS and sensors chipset integration and fusion

            Cost effective package approach for memory card formats

            Laminate / Lead Frame

            • Discrete Packages:TO,SOD,FBP
            • Flip Chip on Leadframe(FCOL)
            • DIP
            • SOP
            • SOT
            • DFN
            • QFP
            • QFN-mr
            • QFN-dr
            • QFN

            Highlights

            Extensive experience in leadframe and discrete packages for a wide range of applications

            Patented FCOL on MIS lead frame offers leading-edge QFN package for proven better

            electrical and thermal performance, particularly in power management applications

            MIS advantages

            Ultra small, thin technology achieves product miniaturization

            Superior RF, electrical, thermal and reliability performance

            Fine line routing for high density I/O

            Supports a wide range of wirebond, flip chip, SiP and PoP package configurations

            Proven substrate technology with over 1B units shipped since 2010

            Contact Us |  Customer |  Legal

            Contact Us Customer Enquiry Legal

            Copyright @ Jiangsu Changjiang Electronics Technology Co., Ltd 蘇ICP備05082751號32028102000607

            Copyright @ Jiangsu Changjiang Electronics Technology Co., Ltd
            蘇ICP備05082751號 32028102000607

            Official Accounts of JCET

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